Keynote Speech IV

June 5, 2017 (Mon.) 11:10 – 11:50
Emerging Trends in Silicon Carbide Power Electronics


Prof. Alan Mantooth


IEEE Fellow


University of Arkansas, USA

PELS Standards Chair





Power electronics



Dr. Mantooth (S'83 - M'90 - SM'97 – F’09) received the B.S. (summa cum laude) and M. S. degrees in electrical engineering from the University of Arkansas in 1985 and 1987, respectively, and the Ph.D. degree from the Georgia Institute of Technology in 1990. He joined Analogy in 1990 where he focused on semiconductor device modeling and the research and development of HDL-based modeling tools and techniques. Besides modeling, his interests include analog and mixed-signal IC design and power electronics. In 1996, Dr. Mantooth was named Distinguished Member of Technical Staff at Analogy (now owned by Synopsys).

In 1998, he joined the faculty of the Department of Electrical Engineering at the University of Arkansas, Fayetteville, as an Associate Professor. He has received numerous teaching, service, and research awards since returning to the UA. He was also selected to the Georgia Tech Council of Outstanding Young Engineering Alumni in 2002, and the Arkansas Academy of Electrical Engineers in 2006. Dr. Mantooth was promoted to his present rank of full professor in the Electrical Engineering Department in 2002. In 2003, he co-founded Lynguent, an EDA company focused on modeling and simulation tools.

Dr. Mantooth helped establish the National Center for Reliable Electric Power Transmission (NCREPT) at the UA in 2005, for which he serves as director. In 2006, he was selected as the inaugural holder of the 21st Century Endowed Chair in Mixed-Signal IC Design and CAD. Dr. Mantooth has published over 150 refereed articles on modeling and IC design. He holds patents on software architecture and algorithms for modeling tools and has others pending. He is co-author of the book Modeling with an Analog Hardware Description Language by Kluwer Academic Publishers and has served on several technical program committees for IEEE conferences. He was the Technical Program Chair for the IEEE International Workshop on Behavioral Modeling and Simulation (BMAS) in 2000 and General Chair in 2001. He served as a Guest Editor for the IEEE Transactions on Computer-Aided Design, the IET Computers and Digital Techniques, and as an IEEE Circuits and Systems Society Distinguished Lecturer.

He is currently serving the profession as IEEE CAS representative on the IEEE Council on Electronic Design Automation and a member of the Power Electronics Society Advisory Committee as Chair of the Society’s Standards Committee. Dr. Mantooth is a Fellow of IEEE, a member of Tau Beta Pi and Eta Kappa Nu, and registered professional engineer in Arkansas. Professor Mantooth serves as the Executive Director for NCREPT as well as two of its constitutive centers of excellence: the NSF I/UCRC on GRid-connected Advanced Power Electronic Systems (GRAPES) and the NSF Vertically-Integrated Center on Transformative Energy Research (VICTER).


Economy and performance are benefits that come with high power density power electronics, just as in the case of VLSI electronics. High density power electronics require the heterogeneous integration of disparate technologies including power semiconductor devices, driver, protection and control circuitry, passives and voltage isolation techniques into single modules. Such integration activity was central to the Google Little Box Challenge competition conducted last year. One of the keys to advancing power electronic integration has been the commercial reality of wide bandgap power semiconductor devices made from silicon carbide and gallium nitride. The ability to design and manufacture wide bandgap integrated circuits as drivers, controllers, and protection circuitry allows them to be packaged in close proximity to the power device die to minimize parasitics that would adversely impact system performance. These impacts include excessive ringing, noise generation, power loss, and, potentially, self-destruction. This talk will describe emerging trends in silicon carbide analog and mixed-signal IC design for power electronic applications. Advanced 3D packaging techniques driven by multi-objective optimization techniques will also be described.